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HI1175JCB

HI1175JCB

Manufacturer No:

HI1175JCB

Manufacturer:

Intersil

Description:

IC ADC 8BIT FLASH 24SOIC

Datasheet:

Datasheet

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HI1175JCB Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.209", 5.30mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Features
    -
  • Voltage - Supply, Digital
    5V
  • Voltage - Supply, Analog
    5V
  • Reference Type
    External, Internal
  • Architecture
    Flash
  • Number of A/D Converters
    1
  • Ratio - S/H:ADC
    1:1
  • Configuration
    S/H-ADC
  • Data Interface
    Parallel
  • Input Type
    Single Ended
  • Number of Inputs
    1
  • Sampling Rate (Per Second)
    20M
  • Number of Bits
    8
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The HI1175JCB is an integrated circuit chip designed for high-speed data transmission applications. Some of its advantages and application scenarios include:1. High-speed data transmission: The HI1175JCB chip supports data rates up to 12.5 Gbps, making it suitable for high-speed communication systems such as optical networks, data centers, and high-speed serial links.2. Low power consumption: The chip is designed with low power consumption in mind, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The HI1175JCB chip is available in a compact package, allowing for easy integration into various devices and systems with limited space.4. Wide operating temperature range: The chip is designed to operate reliably across a wide temperature range, making it suitable for applications in harsh environments.5. Application scenarios: The HI1175JCB chip can be used in various scenarios, including high-speed optical transceivers, fiber optic communication systems, high-speed data links, and other applications requiring high-speed data transmission.Overall, the HI1175JCB integrated circuit chip offers high-speed data transmission capabilities, low power consumption, small form factor, and wide operating temperature range, making it suitable for a range of applications in the field of high-speed communication systems.
HI1175JCB Relevant information