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ADC12DL3200ACF

ADC12DL3200ACF

Manufacturer No:

ADC12DL3200ACF

Manufacturer:

Texas Instruments

Description:

IC ADC 12BIT FOLD INTER 256FCBGA

Datasheet:

Datasheet

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ADC12DL3200ACF Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    256-FCBGA (17x17)
  • Package / Case
    256-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 85°C
  • Features
    Simultaneous Sampling
  • Voltage - Supply, Digital
    1.05V ~ 2V
  • Voltage - Supply, Analog
    1.05V ~ 2V
  • Reference Type
    Internal
  • Architecture
    Folding Interpolating
  • Number of A/D Converters
    2
  • Ratio - S/H:ADC
    0:1
  • Configuration
    MUX-ADC
  • Data Interface
    LVDS - Parallel
  • Input Type
    Differential, Single Ended
  • Number of Inputs
    1, 2
  • Sampling Rate (Per Second)
    3.2G, 6.4G
  • Number of Bits
    12
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The ADC12DL3200ACF is a high-speed analog-to-digital converter (ADC) integrated circuit chip. Some of its advantages and application scenarios include:1. High-speed conversion: The ADC12DL3200ACF is capable of converting analog signals into digital data at a very high speed. It can achieve sampling rates of up to 3.2 GSPS (giga-samples per second), making it suitable for applications that require fast and accurate data acquisition.2. Wide bandwidth: This ADC chip has a wide input bandwidth, typically ranging from DC to several GHz. It can accurately capture high-frequency signals, making it suitable for applications in telecommunications, radar systems, and high-speed data acquisition.3. High resolution: The ADC12DL3200ACF offers high resolution, typically up to 12 bits. This allows for precise and detailed conversion of analog signals into digital data, making it suitable for applications that require high accuracy and precision, such as scientific research and instrumentation.4. Low power consumption: Despite its high-speed and high-resolution capabilities, the ADC12DL3200ACF is designed to consume low power. This makes it suitable for portable and battery-powered applications where power efficiency is crucial.5. Communication systems: The high-speed and high-resolution capabilities of this ADC chip make it suitable for various communication systems, including wireless base stations, software-defined radios, and broadband communication systems. It can accurately convert analog signals into digital data for further processing and transmission.6. Test and measurement equipment: The ADC12DL3200ACF is commonly used in test and measurement equipment, such as oscilloscopes and spectrum analyzers. Its high-speed and high-resolution capabilities enable accurate and detailed signal analysis.7. Medical imaging: The high-speed and high-resolution ADC capabilities are also beneficial in medical imaging applications, such as magnetic resonance imaging (MRI) and computed tomography (CT) scanners. These applications require precise and fast data acquisition for accurate imaging.8. Defense and aerospace: The ADC12DL3200ACF is suitable for defense and aerospace applications that require high-speed and high-resolution data acquisition, such as radar systems, electronic warfare, and satellite communication systems.Overall, the ADC12DL3200ACF integrated circuit chip offers high-speed, high-resolution, and low-power capabilities, making it suitable for a wide range of applications that require fast and accurate analog-to-digital conversion.
ADC12DL3200ACF Relevant information