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AFE5809ZCF

AFE5809ZCF

Manufacturer No:

AFE5809ZCF

Manufacturer:

Texas Instruments

Description:

IC AFE 8 CHAN 14BIT 135NFBGA

Datasheet:

Datasheet

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AFE5809ZCF Specifications

  • Type
    Parameter
  • Supplier Device Package
    135-NFBGA (15x9)
  • Package / Case
    135-BGA
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Digital
    1.7V ~ 1.9V
  • Voltage - Supply, Analog
    1.7V ~ 1.9V, 3.15V ~ 3.6V, 5V
  • Power (Watts)
    158 mW
  • Number of Channels
    8
  • Number of Bits
    14
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The AFE5809ZCF is a high-performance analog front-end (AFE) integrated circuit chip designed for ultrasound imaging applications. Some of its advantages and application scenarios include:1. High Performance: The AFE5809ZCF offers excellent signal-to-noise ratio (SNR) and dynamic range, enabling high-quality ultrasound imaging with clear and detailed images.2. Wide Bandwidth: It supports a wide frequency range, allowing it to be used in various ultrasound imaging applications, including medical imaging, industrial testing, and non-destructive testing.3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for portable and battery-powered ultrasound devices.4. Integrated Features: The AFE5809ZCF integrates various features such as programmable gain amplifiers, analog-to-digital converters, and digital filters, reducing the need for external components and simplifying the design of ultrasound systems.5. Flexible Configuration: The chip offers programmable settings and configurations, allowing users to optimize the performance based on their specific application requirements.6. High Integration: The AFE5809ZCF integrates multiple channels, enabling simultaneous reception of multiple ultrasound signals and improving system throughput.7. Medical Imaging: The chip is commonly used in medical ultrasound imaging systems for applications such as obstetrics, cardiology, and general imaging. Its high performance and low power consumption make it suitable for both portable and stationary medical devices.8. Industrial Testing: The AFE5809ZCF can be used in industrial ultrasound testing applications, such as flaw detection, material characterization, and thickness measurement. Its wide bandwidth and high dynamic range make it suitable for demanding industrial environments.9. Non-Destructive Testing: The chip is also used in non-destructive testing applications, where ultrasound is used to inspect and evaluate the integrity of structures and materials without causing damage. Its high performance and flexibility make it suitable for various non-destructive testing scenarios.Overall, the AFE5809ZCF integrated circuit chip offers high performance, low power consumption, and flexibility, making it suitable for a wide range of ultrasound imaging applications in medical, industrial, and non-destructive testing fields.
AFE5809ZCF Relevant information