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LDC1312DNTR

LDC1312DNTR

Manufacturer No:

LDC1312DNTR

Manufacturer:

Texas Instruments

Description:

IC IND TO DGT CONV 12BIT 12WSON

Datasheet:

Datasheet

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LDC1312DNTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    12-WSON (4x4)
  • Package / Case
    12-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    2.7V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Data Interface
    I²C
  • Sampling Rate (Per Second)
    -
  • Resolution (Bits)
    12 b
  • Number of Channels
    2
  • Type
    Inductance-to-Digital Converter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LDC1312DNTR is an integrated circuit chip designed for inductive sensing applications. It offers several advantages and can be used in various scenarios:1. High Sensitivity: The LDC1312DNTR chip provides high sensitivity for inductive sensing, allowing it to detect small changes in inductance. This makes it suitable for applications that require precise and accurate measurements.2. Non-Contact Sensing: Inductive sensing is a non-contact sensing technology, which means it can measure the position, presence, or movement of objects without physical contact. The LDC1312DNTR chip enables non-contact sensing, making it ideal for applications where contact-based sensing is not feasible or desirable.3. Robust Performance: The LDC1312DNTR chip is designed to operate reliably in harsh environments. It can withstand temperature variations, humidity, and electromagnetic interference, ensuring robust performance in challenging conditions.4. Small Form Factor: The LDC1312DNTR chip comes in a compact package, making it suitable for space-constrained applications. Its small size allows for easy integration into various devices and systems.5. Low Power Consumption: The LDC1312DNTR chip is designed to operate with low power consumption, making it suitable for battery-powered applications. It helps in extending the battery life of devices and reduces overall power consumption.Application Scenarios:1. Proximity Sensing: The LDC1312DNTR chip can be used for proximity sensing applications, such as detecting the presence or absence of objects. It can be employed in touchless switches, security systems, and industrial automation.2. Position Sensing: The high sensitivity of the LDC1312DNTR chip makes it suitable for position sensing applications. It can accurately measure the position of objects, enabling its use in robotics, linear actuators, and automotive systems.3. Displacement Measurement: The LDC1312DNTR chip can be utilized for displacement measurement applications. It can measure the movement or displacement of objects, making it useful in precision manufacturing, quality control, and instrumentation.4. Liquid Level Sensing: The LDC1312DNTR chip's non-contact sensing capability makes it suitable for liquid level sensing applications. It can measure the level of liquids without direct contact, making it ideal for tanks, reservoirs, and fluid monitoring systems.5. Proximity Switching: The LDC1312DNTR chip can be used in proximity switching applications, where it can detect the presence or absence of objects to trigger certain actions. It can be employed in home automation, smart appliances, and touchless interfaces.Overall, the LDC1312DNTR integrated circuit chip offers high sensitivity, non-contact sensing, robust performance, small form factor, and low power consumption, making it suitable for a wide range of applications requiring inductive sensing capabilities.
LDC1312DNTR Relevant information