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LDC2112YFDT

LDC2112YFDT

Manufacturer No:

LDC2112YFDT

Manufacturer:

Texas Instruments

Description:

IC CAP TO DGT CONV 12BIT 16DSBGA

Datasheet:

Datasheet

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LDC2112YFDT Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-DSBGA
  • Package / Case
    16-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TJ)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Voltage Supply Source
    Single Supply
  • Data Interface
    I²C
  • Sampling Rate (Per Second)
    -
  • Resolution (Bits)
    12 b
  • Number of Channels
    2
  • Type
    Inductance-to-Digital Converter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LDC2112YFDT is an integrated circuit chip developed by Texas Instruments. It is a high-resolution, high-speed inductive-to-digital converter that can be used in various applications. Some advantages and application scenarios of the LDC2112YFDT chip are:Advantages: 1. High Resolution: The chip offers high-resolution measurements, allowing for precise sensing and detection of changes in inductance. 2. High Speed: It can perform measurements at high speeds, enabling real-time monitoring and control. 3. Non-Contact Sensing: The chip uses inductive sensing, which does not require physical contact with the target object, making it suitable for applications where contact-based sensing is not feasible. 4. Robust Performance: The chip is designed to operate reliably in harsh environments, with features like temperature compensation and noise rejection. 5. Low Power Consumption: It has low power requirements, making it suitable for battery-powered applications.Application Scenarios: 1. Proximity Sensing: The LDC2112YFDT chip can be used for proximity sensing applications, such as detecting the presence or absence of objects without physical contact. It can be employed in industrial automation, robotics, and security systems. 2. Position and Displacement Sensing: The high-resolution and high-speed capabilities of the chip make it suitable for position and displacement sensing applications. It can be used to measure linear or angular displacement, enabling precise control in applications like motor control, automotive systems, and machine tools. 3. Material Characterization: The chip's ability to measure changes in inductance can be utilized for material characterization applications. It can be used to determine the properties of conductive or magnetic materials, such as thickness, composition, or permeability. This can be applied in industries like manufacturing, quality control, and material science. 4. Liquid Level Sensing: The non-contact sensing capability of the chip makes it suitable for liquid level sensing applications. It can be used to measure the level of liquids in tanks or containers without physical contact, enabling accurate and reliable monitoring in industries like chemical processing, food and beverage, and oil and gas.These are just a few examples of the advantages and application scenarios of the LDC2112YFDT integrated circuit chip. Its versatility and performance make it suitable for a wide range of sensing and measurement applications.
LDC2112YFDT Relevant information