TSE2002GB2A1NCG8

TSE2002GB2A1NCG8

Manufacturer No:

TSE2002GB2A1NCG8

Description:

IC TEMP SENS EEPROM DFN-8

Datasheet:

Datasheet

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TSE2002GB2A1NCG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VFQFPN (2x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -20°C ~ 125°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Output Fan
    No
  • Output Alarm
    No
  • Output Type
    I²C/SMBus
  • Topology
    ADC, Register Bank
  • Accuracy
    ±2°C
  • Sensing Temperature
    -20°C ~ 125°C
  • Sensor Type
    Internal
  • Function
    Temp Monitoring System (Sensor)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The TSE2002GB2A1NCG8 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed operation and efficient processing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: They are designed to consume minimal power, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: They can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 5. Reliability: These chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and long-term performance.Application Scenarios: 1. Consumer Electronics: The TSE2002GB2A1NCG8 chips can be used in smartphones, tablets, smartwatches, and other portable devices, providing high-performance processing capabilities. 2. Internet of Things (IoT): These chips are suitable for IoT devices, enabling efficient data processing and connectivity in smart homes, industrial automation, healthcare monitoring, and more. 3. Automotive: They can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units, providing reliable and efficient processing. 4. Industrial Automation: The chips can be utilized in industrial control systems, robotics, and factory automation, enabling real-time data processing and control. 5. Communication Systems: They can be integrated into networking equipment, routers, switches, and other communication devices, providing high-speed data processing and network connectivity.Overall, the TSE2002GB2A1NCG8 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for various applications in consumer electronics, IoT, automotive, industrial automation, and communication systems.