Home / Thermal Management / TSE2002B3CNCG8/
TSE2002B3CNCG8

TSE2002B3CNCG8

Manufacturer No:

TSE2002B3CNCG8

Description:

IC TEMP SENS EEPROM TDFN-8

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TSE2002B3CNCG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VFQFPN (2x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -20°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V
  • Output Fan
    No
  • Output Alarm
    No
  • Output Type
    2-Wire Serial, I²C/SMBUS
  • Topology
    ADC (Sigma Delta), Control Logic, Register Bank
  • Accuracy
    ±1°C(Max)
  • Sensing Temperature
    -20°C ~ 125°C
  • Sensor Type
    Internal
  • Function
    Temp Monitoring System (Sensor)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The TSE2002B3CNCG8 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed operation and low power consumption, making them suitable for applications that require efficient processing and minimal energy usage. 2. Compact Size: The chips are designed to be compact, allowing for easy integration into various electronic devices and systems. 3. Versatility: They can be used in a wide range of applications, thanks to their flexible architecture and compatibility with different interfaces and protocols. 4. Robustness: The chips are built to withstand harsh environmental conditions, making them suitable for industrial applications that require ruggedness and reliability. 5. Cost-Effective: These chips offer a cost-effective solution for various applications, as they provide high performance at a competitive price point.Application Scenarios: 1. Industrial Automation: The TSE2002B3CNCG8 chips can be used in industrial automation systems for tasks such as control and monitoring of machinery, process automation, and data acquisition. 2. Internet of Things (IoT): These chips can be integrated into IoT devices for connectivity, data processing, and communication purposes, enabling smart home automation, asset tracking, and remote monitoring. 3. Automotive Electronics: The chips can be utilized in automotive applications, including advanced driver-assistance systems (ADAS), vehicle infotainment systems, and engine control units (ECUs). 4. Consumer Electronics: They can be used in various consumer electronic devices such as smartphones, tablets, wearables, and smart appliances, providing high-performance processing capabilities. 5. Medical Devices: The chips can be employed in medical devices and equipment for tasks like patient monitoring, diagnostics, and medical imaging, ensuring accurate and efficient data processing.Overall, the TSE2002B3CNCG8 integrated circuit chips offer high performance, versatility, and robustness, making them suitable for a wide range of applications in different industries.
TSE2002B3CNCG8 Relevant information