TSE2002GB2A1NCG
Manufacturer No:
TSE2002GB2A1NCG
Manufacturer:
Description:
IC TEMP SENS EEPROM DFN-8
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
TSE2002GB2A1NCG Specifications
-
TypeParameter
-
Supplier Device Package8-VFQFPN (2x3)
-
Package / Case8-WFDFN Exposed Pad
-
Mounting TypeSurface Mount
-
Operating Temperature-20°C ~ 125°C
-
Voltage - Supply2.3V ~ 3.6V
-
Output FanNo
-
Output AlarmNo
-
Output TypeI²C/SMBus
-
TopologyADC, Register Bank
-
Accuracy±2°C
-
Sensing Temperature-20°C ~ 125°C
-
Sensor TypeInternal
-
FunctionTemp Monitoring System (Sensor)
-
PackagingTube
-
Product StatusObsolete
-
Series-
The TSE2002GB2A1NCG integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed operation and efficient processing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: They are designed to consume minimal power, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: They can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 5. Reliability: These chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and long-term performance.Application Scenarios: 1. Internet of Things (IoT): The TSE2002GB2A1NCG chips can be used in IoT devices, such as smart home systems, wearable devices, and industrial sensors, to enable connectivity and data processing. 2. Consumer Electronics: They can be integrated into smartphones, tablets, and other consumer electronic devices to enhance their performance and functionality. 3. Automotive: These chips can be used in automotive systems, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units, to enable efficient processing and connectivity. 4. Industrial Automation: They are suitable for industrial automation applications, including robotics, process control systems, and factory automation, to enable precise control and data processing. 5. Medical Devices: The chips can be used in medical devices, such as patient monitoring systems, diagnostic equipment, and implantable devices, to enable accurate data processing and communication.Overall, the TSE2002GB2A1NCG integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for various applications in IoT, consumer electronics, automotive, industrial automation, and medical devices.
TSE2002GB2A1NCG Relevant information
-
ADM1029ARQZ-R7
onsemi -
STTS2002B2DN3F
STMicroelectronics -
MAX6616AEG+T
Analog Devices Inc./Maxim Integrated -
MAX6616AEG+
Analog Devices Inc./Maxim Integrated -
DS1629S-C05+T&R
Analog Devices Inc./Maxim Integrated -
DS1629S-C05+
Analog Devices Inc./Maxim Integrated -
LDS9003-002-T2
IXYS Integrated Circuits Division -
MCP98243T-BE/MCAB
Microchip Technology -
MCP98242T-BE/MNYBAC
Microchip Technology -
MCP98242T-BE/MNYBA2
Microchip Technology