TSE2002B3CNRG
Manufacturer No:
TSE2002B3CNRG
Manufacturer:
Description:
IC TEMP SENS EEPROM DFN-8
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
TSE2002B3CNRG Specifications
-
TypeParameter
-
Supplier Device Package8-VFQFPN (2x3)
-
Package / Case8-VFDFN Exposed Pad
-
Mounting TypeSurface Mount
-
Operating Temperature-20°C ~ 125°C
-
Voltage - Supply3V ~ 3.6V
-
Output FanNo
-
Output AlarmNo
-
Output Type2-Wire Serial, I²C/SMBUS
-
TopologyADC (Sigma Delta), Control Logic, Register Bank
-
Accuracy±1°C(Max)
-
Sensing Temperature-20°C ~ 125°C
-
Sensor TypeInternal
-
FunctionTemp Monitoring System (Sensor)
-
PackagingTube
-
Product StatusObsolete
-
Series-
The TSE2002B3CNRG integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with minimal power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. High integration: The TSE2002B3CNRG chips integrate multiple functions and features into a single chip, reducing the need for external components and simplifying the overall system design. 3. Small form factor: The chips are compact in size, making them suitable for applications with space constraints or where miniaturization is required. 4. Robust performance: These chips offer reliable and stable performance, ensuring consistent operation even in challenging environments. 5. Cost-effective: The integration of multiple functions into a single chip reduces the overall system cost, making them an economical choice for various applications.Application scenarios: 1. Internet of Things (IoT): The TSE2002B3CNRG chips can be used in IoT devices such as smart home appliances, wearable devices, and industrial sensors, where low power consumption, small size, and high integration are crucial. 2. Wireless communication: These chips can be used in wireless communication systems, including Bluetooth, Zigbee, and other short-range wireless protocols, enabling wireless connectivity in various applications. 3. Consumer electronics: The chips can be utilized in various consumer electronic devices such as smartphones, tablets, and smartwatches, where power efficiency and compact size are important. 4. Industrial automation: The TSE2002B3CNRG chips can be employed in industrial automation systems, including process control, monitoring, and data acquisition, where reliable and low-power operation is required. 5. Medical devices: These chips can be used in medical devices such as wearable health monitors, remote patient monitoring systems, and implantable devices, where small size, low power consumption, and high integration are critical.Overall, the TSE2002B3CNRG integrated circuit chips offer several advantages and find applications in various industries and technologies, ranging from IoT and wireless communication to consumer electronics and medical devices.
TSE2002B3CNRG Relevant information
-
ADM1029ARQZ-R7
onsemi -
STTS2002B2DN3F
STMicroelectronics -
MAX6616AEG+T
Analog Devices Inc./Maxim Integrated -
MAX6616AEG+
Analog Devices Inc./Maxim Integrated -
DS1629S-C05+T&R
Analog Devices Inc./Maxim Integrated -
DS1629S-C05+
Analog Devices Inc./Maxim Integrated -
LDS9003-002-T2
IXYS Integrated Circuits Division -
MCP98243T-BE/MCAB
Microchip Technology -
MCP98242T-BE/MNYBAC
Microchip Technology -
MCP98242T-BE/MNYBA2
Microchip Technology