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TSE2002B3CNRG8

TSE2002B3CNRG8

Manufacturer No:

TSE2002B3CNRG8

Description:

IC TEMP SENS EEPROM DFN-8

Datasheet:

Datasheet

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TSE2002B3CNRG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VFQFPN (2x3)
  • Package / Case
    8-VFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -20°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V
  • Output Fan
    No
  • Output Alarm
    No
  • Output Type
    2-Wire Serial, I²C/SMBUS
  • Topology
    ADC (Sigma Delta), Control Logic, Register Bank
  • Accuracy
    ±1°C(Max)
  • Sensing Temperature
    -20°C ~ 125°C
  • Sensor Type
    Internal
  • Function
    Temp Monitoring System (Sensor)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The TSE2002B3CNRG8 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed operation and low power consumption, making them suitable for applications that require efficient processing and minimal energy usage. 2. Compact Size: The chips are designed to be compact, allowing for easy integration into various electronic devices and systems. 3. Versatility: They can be used in a wide range of applications, thanks to their flexible design and compatibility with different interfaces and protocols. 4. Robustness: The chips are built to withstand harsh environmental conditions, making them suitable for industrial applications that require durability and reliability. 5. Cost-Effective: These chips offer a cost-effective solution for various applications, as they provide high performance at a reasonable price point.Application Scenarios: 1. Internet of Things (IoT): The TSE2002B3CNRG8 chips can be used in IoT devices, such as smart home systems, wearable devices, and industrial sensors, to enable efficient data processing and communication. 2. Industrial Automation: These chips can be utilized in industrial automation systems, including robotics, process control, and monitoring, to enable real-time data processing and control. 3. Automotive Electronics: The chips can be integrated into automotive electronics, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units, to enhance performance and efficiency. 4. Communication Systems: They can be used in communication systems, such as routers, switches, and network equipment, to enable high-speed data processing and transmission. 5. Consumer Electronics: The chips can be employed in various consumer electronic devices, including smartphones, tablets, and gaming consoles, to enhance performance and power efficiency.Overall, the TSE2002B3CNRG8 integrated circuit chips offer high performance, versatility, and cost-effectiveness, making them suitable for a wide range of applications in different industries.
TSE2002B3CNRG8 Relevant information