SIC401BCD-T1-GE3
Manufacturer No:
SIC401BCD-T1-GE3
Manufacturer:
Description:
IC REG DL BUCK/LNR SYNC MLP55-32
Datasheet:
Delivery:
Payment:
In Stock : 2980
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SIC401BCD-T1-GE3 Specifications
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TypeParameter
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Supplier Device PackagePowerPAK® MLP55-32
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Package / Case32-PowerVFQFN
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3V ~ 17V
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w/SequencerNo
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w/SupervisorNo
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w/LED DriverNo
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Voltage/Current - Output 3-
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Voltage/Current - Output 2Adj to 0.75V, 200mA
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Voltage/Current - Output 10.6V ~ 5.5V, 15A
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Frequency - Switching200kHz ~ 1MHz
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Number of Outputs2
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TopologyStep-Down (Buck) Synchronous (1), Linear (LDO) (1)
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesmicroBUCK®
The SIC401BCD-T1-GE3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Efficiency: These chips offer high efficiency power conversion, which helps in reducing power losses and improving overall system efficiency. 2. Compact Size: The chips are designed to be compact, making them suitable for applications where space is limited. 3. High Voltage Capability: They can handle high voltage levels, making them suitable for applications that require high voltage power conversion. 4. Low Switching Losses: The chips have low switching losses, which helps in reducing power dissipation and improving overall system performance. 5. High Reliability: These chips are designed to be highly reliable, ensuring long-term operation without failure.Application Scenarios: 1. Power Supplies: The SIC401BCD-T1-GE3 chips can be used in power supply applications, such as AC-DC converters, DC-DC converters, and inverters. 2. Industrial Applications: They can be used in various industrial applications, including motor drives, robotics, and industrial automation systems. 3. Renewable Energy Systems: These chips are suitable for renewable energy systems, such as solar inverters and wind power converters. 4. Electric Vehicles: They can be used in electric vehicle charging systems and powertrain applications. 5. Telecom and Datacom: The chips can be used in telecom and datacom applications, such as telecom power supplies and data center power distribution.Overall, the SIC401BCD-T1-GE3 integrated circuit chips offer high efficiency, compact size, and high voltage capability, making them suitable for a wide range of power conversion applications in various industries.
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