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MAX8667ETEHR+

MAX8667ETEHR+

Manufacturer No:

MAX8667ETEHR+

Description:

IC REG QUAD BUCK/LNR SYNC 16TQFN

Datasheet:

Datasheet

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MAX8667ETEHR+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.8V ~ 5.5V
  • w/Sequencer
    No
  • w/Supervisor
    No
  • w/LED Driver
    No
  • Voltage/Current - Output 3
    2.6V, 300mA
  • Voltage/Current - Output 2
    1.2V, 1.2A
  • Voltage/Current - Output 1
    1.8V, 600mA
  • Frequency - Switching
    1.5MHz
  • Number of Outputs
    4
  • Topology
    Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MAX8667ETEHR+ is a highly integrated power management IC (PMIC) chip designed for portable devices such as smartphones, tablets, and other handheld devices. It offers several advantages and can be applied in various scenarios:1. High Integration: The MAX8667ETEHR+ integrates multiple power management functions into a single chip, including a step-down (buck) converter, a linear regulator, a battery charger, and a power switch. This high level of integration reduces the overall component count and PCB space required for power management, making it ideal for space-constrained portable devices.2. Efficient Power Conversion: The chip incorporates a high-efficiency step-down converter that can deliver up to 2A of output current. This allows for efficient power conversion, minimizing power losses and maximizing battery life in portable devices.3. Battery Charging: The MAX8667ETEHR+ includes a battery charger circuitry that supports lithium-ion (Li+) and lithium-polymer (Li-Po) batteries. It provides a programmable charging current and voltage, ensuring safe and optimized charging for the battery.4. Thermal Management: The chip features built-in thermal protection and thermal regulation mechanisms. It monitors the temperature and adjusts the power dissipation accordingly, preventing overheating and ensuring reliable operation.5. Flexible Power Sequencing: The MAX8667ETEHR+ offers flexible power sequencing options, allowing for proper power-up and power-down sequencing of different power rails in the system. This ensures that the device operates reliably and avoids any potential damage due to improper power sequencing.Application Scenarios:1. Smartphones and Tablets: The MAX8667ETEHR+ is commonly used in smartphones and tablets to provide efficient power management, battery charging, and thermal management. Its high integration and small form factor make it suitable for these compact devices.2. Portable Medical Devices: Portable medical devices, such as patient monitors or handheld diagnostic tools, can benefit from the MAX8667ETEHR+ chip's power management capabilities. It enables efficient power conversion, battery charging, and thermal management, ensuring reliable operation in critical medical applications.3. Wearable Devices: The chip's small size, high integration, and efficient power conversion make it suitable for wearable devices like smartwatches, fitness trackers, or augmented reality glasses. It helps optimize power consumption and extends battery life in these battery-powered wearables.4. Portable Industrial Equipment: Portable industrial equipment, such as handheld scanners or measurement devices, can utilize the MAX8667ETEHR+ for power management and battery charging. Its high integration and thermal management features ensure reliable operation in demanding industrial environments.Overall, the MAX8667ETEHR+ chip offers advantages of high integration, efficient power conversion, battery charging, and thermal management. Its application scenarios range from smartphones and tablets to portable medical devices, wearables, and portable industrial equipment.
MAX8667ETEHR+ Relevant information