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MAX8667ETEAC+

MAX8667ETEAC+

Manufacturer No:

MAX8667ETEAC+

Description:

IC REG QUAD BUCK/LNR SYNC 16TQFN

Datasheet:

Datasheet

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MAX8667ETEAC+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.8V ~ 5.5V
  • w/Sequencer
    No
  • w/Supervisor
    No
  • w/LED Driver
    No
  • Voltage/Current - Output 3
    1.2V, 300mA
  • Voltage/Current - Output 2
    1.8V, 1.2A
  • Voltage/Current - Output 1
    1.2V, 600mA
  • Frequency - Switching
    1.5MHz
  • Number of Outputs
    4
  • Topology
    Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MAX8667ETEAC+ is a highly integrated power management IC (PMIC) chip designed for portable devices such as smartphones, tablets, and other handheld devices. It offers several advantages and can be applied in various scenarios:1. High Integration: The MAX8667ETEAC+ integrates multiple power management functions into a single chip, including a step-down (buck) converter, a linear regulator, a battery charger, and a power switch. This high level of integration reduces the overall component count and PCB space required for power management, making it ideal for space-constrained portable devices.2. Efficient Power Conversion: The chip incorporates a high-efficiency step-down converter that can deliver up to 2A of output current. This allows for efficient power conversion, minimizing power losses and maximizing battery life in portable devices.3. Battery Charging: The MAX8667ETEAC+ includes a battery charger circuitry that supports lithium-ion (Li+) and lithium-polymer (Li-Po) batteries. It provides a programmable charging current and voltage, ensuring safe and optimized charging for the battery.4. Thermal Management: The chip features built-in thermal protection and thermal regulation mechanisms. It monitors the temperature and adjusts the power dissipation accordingly, preventing overheating and ensuring reliable operation.5. Flexible Power Sequencing: The MAX8667ETEAC+ offers flexible power sequencing options, allowing for proper power-up and power-down sequences of different device subsystems. This ensures proper operation and prevents any potential damage due to improper power sequencing.Application Scenarios:1. Smartphones and Tablets: The MAX8667ETEAC+ can be used in smartphones and tablets to provide efficient power management, battery charging, and thermal management. Its high integration and small form factor make it suitable for these compact devices.2. Portable Medical Devices: Portable medical devices, such as patient monitors or handheld diagnostic tools, can benefit from the MAX8667ETEAC+ chip's power management capabilities. It can provide efficient power conversion, battery charging, and thermal protection in these critical applications.3. Wearable Devices: The chip's small size and power management features make it suitable for wearable devices like smartwatches, fitness trackers, or augmented reality glasses. It can efficiently manage power and charge the device's battery while ensuring thermal safety.4. Portable Audio Devices: The MAX8667ETEAC+ can be used in portable audio devices like MP3 players or Bluetooth speakers. It provides efficient power conversion for audio amplifiers, battery charging, and thermal management, enhancing the overall performance and battery life of these devices.Overall, the MAX8667ETEAC+ chip's advantages of high integration, efficient power conversion, battery charging, and thermal management make it a versatile solution for various portable device applications.
MAX8667ETEAC+ Relevant information