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MAX8667ETECQ+

MAX8667ETECQ+

Manufacturer No:

MAX8667ETECQ+

Description:

IC REG QD BCK/LINEAR SYNC 16TQFN

Datasheet:

Datasheet

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MAX8667ETECQ+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.8V ~ 5.5V
  • w/Sequencer
    No
  • w/Supervisor
    No
  • w/LED Driver
    No
  • Voltage/Current - Output 3
    2.8V, 300mA
  • Voltage/Current - Output 2
    1.8V, 1.2A
  • Voltage/Current - Output 1
    1.6V, 600mA
  • Frequency - Switching
    1.5MHz
  • Number of Outputs
    4
  • Topology
    Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MAX8667ETECQ+ is a highly integrated power management IC (PMIC) chip designed for portable devices such as smartphones, tablets, and other handheld devices. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MAX8667ETECQ+ are:1. High Integration: The MAX8667ETECQ+ integrates multiple power management functions into a single chip, including a battery charger, a step-down converter, a linear regulator, and a power switch. This high integration reduces the overall component count and board space required for power management, making it suitable for compact portable devices.2. Efficient Power Conversion: The chip incorporates a high-efficiency step-down converter that can deliver up to 2A of current. This allows for efficient power conversion, reducing power losses and extending battery life in portable devices.3. Battery Charging: The MAX8667ETECQ+ includes a battery charger circuitry that supports lithium-ion (Li+) and lithium-polymer (Li-Po) batteries. It provides a programmable charging current and voltage, ensuring safe and optimized charging for the battery.4. Thermal Management: The chip features built-in thermal protection and thermal regulation mechanisms. It monitors the temperature and adjusts the power dissipation accordingly, preventing overheating and ensuring reliable operation.5. Flexible Power Sequencing: The MAX8667ETECQ+ offers flexible power sequencing options, allowing for proper power-up and power-down sequencing of different power rails in the system. This ensures reliable operation and prevents any potential damage to the device.6. Small Form Factor: The chip is available in a compact, space-saving package, making it suitable for applications with limited board space.Application scenarios for the MAX8667ETECQ+ include:1. Smartphones and Tablets: The chip can be used in smartphones and tablets to manage power conversion, battery charging, and thermal management. Its high integration and efficiency make it ideal for these portable devices.2. Portable Medical Devices: The MAX8667ETECQ+ can be applied in portable medical devices such as patient monitors, handheld diagnostic devices, and wearable health trackers. It provides efficient power management and battery charging capabilities for these devices.3. Portable Industrial Equipment: The chip can be used in portable industrial equipment such as handheld meters, data loggers, and portable test equipment. Its small form factor and integrated power management functions make it suitable for these applications.4. Portable Consumer Electronics: The MAX8667ETECQ+ can be applied in various portable consumer electronics devices such as portable gaming consoles, digital cameras, and portable media players. It provides efficient power management and battery charging solutions for these devices.Overall, the MAX8667ETECQ+ offers high integration, efficient power conversion, and flexible power management capabilities, making it suitable for a wide range of portable devices requiring compact and reliable power management solutions.
MAX8667ETECQ+ Relevant information