MAX20008EAFOA/VY+T

MAX20008EAFOA/VY+T

Manufacturer No:

MAX20008EAFOA/VY+T

Description:

IC CONV STEP DOWN 36V 17QFN

Datasheet:

Datasheet

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MAX20008EAFOA/VY+T Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 125°C
  • Synchronous Rectifier
    Yes
  • Frequency - Switching
    2.1MHz
  • Current - Output
    8A
  • Voltage - Output (Max)
    -
  • Voltage - Output (Min/Fixed)
    5V
  • Voltage - Input (Max)
    36V
  • Voltage - Input (Min)
    3.5V
  • Number of Outputs
    1
  • Output Type
    Fixed
  • Topology
    Buck
  • Output Configuration
    Positive
  • Function
    Step-Down
  • Supplier Device Package
    17-FC2QFN (3.5x3.75)
  • Package / Case
    17-PowerWFQFN
  • Mounting Type
    Surface Mount, Wettable Flank
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
Advantages:1. High Efficiency: The MAX20008EAFOA/VY+T integrated circuit chip has a high efficiency that reduces power consumption.2. Thermal Management: The integrated circuit chip has an over-temperature protection system that protects the system from overheating.3. Easy to Use: The MAX20008EAFOA/VY+T is simple to use with minimal external components.4. Small Footprint: The chip has a small form factor which makes it easy to integrate into systems with limited space.Application Scenarios:1. Automotive LED Lighting: The MAX20008EAFOA/VY+T can be used for automotive LED lighting applications for improved efficiency and thermal management.2. Industrial Lighting: The chip can be used for industrial lighting applications where high efficiency and thermal management are required.3. Portable Devices: The small form factor of the integrated circuit chip makes it ideal for portable devices such as mobile phones and tablets.4. Consumer Electronics: The high efficiency of the MAX20008EAFOA/VY+T makes it ideal for a range of consumer electronics applications such as televisions and monitors. In summary, the MAX20008EAFOA/VY+T integrated circuit chip is versatile and can be used in a variety of applications where high efficiency, small form factor, and thermal management are critical requirements.