MAX77827BEWC+
Manufacturer No:
MAX77827BEWC+
Manufacturer:
Description:
IC REG BUCK BST 1.8A 12WLP
Datasheet:
Delivery:
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Payment:
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In Stock : 469
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MAX77827BEWC+ Specifications
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TypeParameter
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Supplier Device Package12-WLP (1.61x2.01)
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Package / Case12-WFBGA, WLBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TJ)
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Synchronous RectifierNo
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Frequency - Switching2.5MHz
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Current - Output1.8A (Switch)
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Voltage - Output (Max)5.3V
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Voltage - Output (Min/Fixed)2.3V
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Voltage - Input (Max)5.5V
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Voltage - Input (Min)2.6V
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Number of Outputs1
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Output TypeAdjustable
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TopologyBuck-Boost
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Output ConfigurationPositive
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FunctionStep-Up/Step-Down
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PackagingStrip
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Product StatusActive
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Series-
The MAX77827BEWC+ is a highly integrated power management IC (PMIC) chip designed for use in mobile devices such as smartphones and tablets. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MAX77827BEWC+ are:1. High Integration: The MAX77827BEWC+ integrates multiple power management functions into a single chip, including voltage regulators, battery charger, fuel gauge, and power switches. This high level of integration reduces the overall component count, saves board space, and simplifies the design process.2. Efficient Power Management: The chip incorporates high-efficiency voltage regulators that provide precise power supply to different components of the device. This helps in optimizing power consumption, extending battery life, and improving overall system efficiency.3. Fast Charging: The MAX77827BEWC+ includes a battery charger with support for fast charging protocols such as Qualcomm Quick Charge and USB Power Delivery. This enables rapid charging of the device's battery, reducing charging times and improving user convenience.4. Battery Monitoring: The chip features a fuel gauge that accurately measures the battery's state of charge and provides information about battery health and capacity. This helps in monitoring battery performance, predicting battery life, and implementing battery protection mechanisms.5. Thermal Management: The MAX77827BEWC+ incorporates thermal management features such as thermal regulation and thermal shutdown protection. These features help in preventing overheating of the device and ensure safe operation under varying thermal conditions.6. Mobile Devices: The chip is specifically designed for use in mobile devices such as smartphones and tablets. It can be applied in various scenarios where efficient power management, fast charging, and battery monitoring are crucial, including consumer electronics, portable devices, and IoT devices.Overall, the MAX77827BEWC+ offers a comprehensive power management solution for mobile devices, combining high integration, efficient power management, fast charging, and battery monitoring capabilities. Its application scenarios range from smartphones and tablets to various portable and IoT devices.
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