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MAX77827DEFD+T

MAX77827DEFD+T

Manufacturer No:

MAX77827DEFD+T

Description:

TINY BUCK-BOOST CONV

Datasheet:

Datasheet

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MAX77827DEFD+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-FC2QFN (2.5x2.5)
  • Package / Case
    14-PowerUFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TJ)
  • Synchronous Rectifier
    No
  • Frequency - Switching
    2.5MHz
  • Current - Output
    1.6A
  • Voltage - Output (Max)
    5.3V
  • Voltage - Output (Min/Fixed)
    2.3V
  • Voltage - Input (Max)
    5.5V
  • Voltage - Input (Min)
    2.6V
  • Number of Outputs
    1
  • Output Type
    Adjustable
  • Topology
    Buck-Boost
  • Output Configuration
    Positive
  • Function
    Step-Up/Step-Down
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MAX77827DEFD+T is a highly integrated power management IC (PMIC) chip designed for use in mobile devices such as smartphones and tablets. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High Integration: The MAX77827DEFD+T integrates multiple power management functions into a single chip, reducing the need for external components and saving board space. 2. Efficiency: It incorporates high-efficiency DC-DC converters, which help optimize power conversion and reduce power losses, resulting in improved overall system efficiency. 3. Flexibility: The chip provides programmable power sequencing and voltage scaling, allowing for customization and optimization of power delivery to different components in the device. 4. Thermal Management: It includes thermal management features such as thermal warning and thermal shutdown, ensuring safe operation and preventing overheating. 5. Protection Features: The chip offers various protection features like overvoltage protection, undervoltage lockout, and overcurrent protection, safeguarding the device and its components from potential damage.Application Scenarios: 1. Mobile Devices: The MAX77827DEFD+T is primarily designed for use in mobile devices like smartphones and tablets. It can efficiently manage power delivery to various components such as processors, memory, display, cameras, and wireless modules. 2. Wearable Devices: With its compact size and high integration, the chip can be applied in wearable devices like smartwatches and fitness trackers, providing efficient power management for the device's components. 3. Portable Electronics: The PMIC chip can be used in various portable electronic devices such as portable gaming consoles, portable media players, and handheld scanners, ensuring optimal power management and longer battery life. 4. Internet of Things (IoT) Devices: The MAX77827DEFD+T can be utilized in IoT devices that require efficient power management, such as smart home devices, industrial sensors, and connected healthcare devices. 5. Automotive Electronics: The chip's protection features and thermal management capabilities make it suitable for automotive applications, where reliable power management is crucial for various electronic systems within the vehicle.Overall, the MAX77827DEFD+T PMIC chip offers advantages like high integration, efficiency, flexibility, and protection features, making it suitable for a wide range of applications in mobile devices, wearables, portable electronics, IoT devices, and automotive electronics.
MAX77827DEFD+T Relevant information