LTC3639EMSE#PBF

LTC3639EMSE#PBF

Manufacturer No:

LTC3639EMSE#PBF

Manufacturer:

Analog Devices Inc.

Description:

IC REG BUCK ADJ 100MA 16MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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LTC3639EMSE#PBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-MSOP-EP
  • Package / Case
    16-TFSOP (0.118", 3.00mm Width), 12 Leads, Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TJ)
  • Synchronous Rectifier
    Yes
  • Frequency - Switching
    -
  • Current - Output
    100mA
  • Voltage - Output (Max)
    150V
  • Voltage - Output (Min/Fixed)
    0.8V
  • Voltage - Input (Max)
    150V
  • Voltage - Input (Min)
    4V
  • Number of Outputs
    1
  • Output Type
    Adjustable
  • Topology
    Buck
  • Output Configuration
    Positive
  • Function
    Step-Down
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
Advantages of LTC3639EMSE#PBF integrated circuit chips:1. High efficiency: The LTC3639EMSE#PBF chip has a high efficiency of up to 95%, which reduces power consumption and improves device performance.2. Wide input voltage range: The chip has a wide input voltage range of 4V to 20V, making it suitable for a variety of applications.3. Small size: LTC3639EMSE#PBF is small and compact, making it ideal for use in space-constrained applications.4. Easy to use: The chip is easy to use and requires minimal external components for operation.Application scenarios of LTC3639EMSE#PBF integrated circuit chips:1. Distributed power systems: The chip can be used in distributed power systems to efficiently step down the voltage from an input source to power multiple loads.2. Telecom and network equipment: The chip can be used in telecom and network equipment to provide regulated power to various components.3. Industrial equipment: The chip can be used in industrial equipment to provide power to sensors, controllers, and other components.4. Automotive electronics: The chip can be used in automotive electronics to provide power to various subsystems, including infotainment systems and sensors.