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ZL38052LDF1

ZL38052LDF1

Manufacturer No:

ZL38052LDF1

Manufacturer:

Description:

IC AUDIO SIGNAL PROCESSOR 64QFN

Datasheet:

Datasheet

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ZL38052LDF1 Specifications

  • Type
    Parameter
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Applications
    -
  • Function
    Audio Signal Processor
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    -
The ZL38052LDF1 integrated circuit chip is a highly versatile and advanced audio processing solution. It offers several advantages and can be applied in various scenarios, including:1. High-performance audio processing: The ZL38052LDF1 chip provides advanced audio processing capabilities, such as acoustic echo cancellation, noise reduction, and beamforming. These features enhance the audio quality and intelligibility in applications like conference systems, smart speakers, and voice-enabled devices.2. Multi-microphone array support: This chip supports multiple microphones, enabling the implementation of microphone arrays for beamforming and spatial audio processing. It can accurately capture and process audio from different directions, making it suitable for applications like voice-controlled assistants and smart home devices.3. Low power consumption: The ZL38052LDF1 chip is designed to operate efficiently with low power consumption. This makes it suitable for battery-powered devices, such as portable speakers, wireless headphones, and IoT devices, where power efficiency is crucial for extended battery life.4. Flexible and programmable architecture: The chip's architecture is highly flexible and programmable, allowing developers to customize and optimize the audio processing algorithms according to their specific requirements. This flexibility makes it suitable for a wide range of applications, from consumer electronics to professional audio systems.5. Integrated audio interfaces: The ZL38052LDF1 chip integrates various audio interfaces, including I2S, TDM, and PDM, making it easy to interface with different audio input and output devices. This simplifies the design and integration process for audio systems, reducing development time and costs.Overall, the ZL38052LDF1 integrated circuit chip offers advanced audio processing capabilities, low power consumption, and flexibility, making it suitable for a wide range of applications, including conference systems, smart speakers, voice-controlled assistants, portable audio devices, and IoT devices.
ZL38052LDF1 Relevant information