SN74SSTL16847DGGR
Manufacturer No:
SN74SSTL16847DGGR
Manufacturer:
Description:
IC BUF NON-INVERT 3.6V 64TSSOP
Datasheet:
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SN74SSTL16847DGGR Specifications
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TypeParameter
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Supplier Device Package64-TSSOP
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Package / Case64-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Voltage - Supply3V ~ 3.6V
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Current - Output High, Low20mA, 20mA
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Output Type3-State
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Input Type-
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Number of Bits per Element20
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Number of Elements1
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74SSTL
The SN74SSTL16847DGGR is a high-speed bus transceiver integrated circuit chip. It is designed for use in high-performance memory, data communication, telecom, and networking applications. Here are some advantages and application scenarios of this chip:Advantages:1. High-speed performance: The SN74SSTL16847DGGR chip operates at high data transfer rates, making it suitable for applications that require fast and efficient communication.2. Low power consumption: This chip has low power requirements, allowing for energy-efficient operation in portable devices or systems with limited power budgets.3. Bidirectional data transmission: It supports bidirectional communication, allowing data to be transmitted and received on the same bus.4. Voltage translation: The SN74SSTL16847DGGR chip incorporates voltage level translators, enabling communication between systems operating at different voltage levels.5. ESD protection: It features built-in electrostatic discharge (ESD) protection, which safeguards the chip against damage from electrical transients.Application Scenarios:1. Memory interface: The SN74SSTL16847DGGR chip is often used in memory module interfaces, such as DDR (Double Data Rate) SDRAM and DDR2 SDRAM. It enables high-speed data transfer between the memory module and the memory controller.2. Data communication systems: This chip can be utilized in systems that require fast data transmission between different components, such as routers, switches, and network cards.3. Telecommunication equipment: The SN74SSTL16847DGGR chip finds application in telecom infrastructure equipment, such as base stations or central office switches, where it facilitates high-speed communication between different modules.4. High-performance computing: It is suitable for use in high-performance computing systems, such as servers or data centers, as it offers high-speed data transfer capabilities required for efficient processing and storage operations.5. Consumer electronics: This chip can be integrated into various consumer electronic devices like laptops, tablets, and gaming consoles, where it aids in fast and reliable communication between different subsystems.Overall, the SN74SSTL16847DGGR chip's high-speed performance, low power consumption, bidirectional data transmission, and voltage translation capabilities make it suitable for a wide range of applications requiring efficient communication and data transfer.
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