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  • Packaging
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  • Package / Case
    • 32-DIP (0.600", 15.24mm) Socket
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  • Supplier Device Package
    • 32-DIP Socket
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    • 1210-FCBGA
    • 1257-FCBGA (40x37.5)
    • 1432-FCBGA (42.5x42.5)
  • Controller Type

Attribute column

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357 Results

Product

Quantity

Series

Packaging

Product Status

Voltage - Supply

Operating Temperature

Mounting Type

Package / Case

Supplier Device Package

Controller Type

IBM25PPC750FX

Bulk

Active

3.135V ~ 3.465V

-40°C ~ 105°C (TJ)

Surface Mount

474-BCBGA Exposed Pad

474-CBGA (25x32)

Dynamic RAM (DRAM)

DP8422AVX-25
DP8422AVX-25

National Semiconductor

-

Bulk

Obsolete

4.5V ~ 5.5V

0°C ~ 70°C

Surface Mount

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

Dynamic RAM (DRAM)

-

Bulk

Active

4.5V ~ 5.5V

0°C ~ 70°C (TC)

Surface Mount

100-QFP Bumpered

100-QFP

Dynamic RAM (DRAM)

-

Bulk

Active

4.5V ~ 5.5V

0°C ~ 70°C (TC)

Surface Mount

100-QFP Bumpered

100-QFP

Dynamic RAM (DRAM)

RG82875
RG82875

Intel

-

Bulk

Active

-

-

Surface Mount

1005-BBGA, FCBGA

1005-FCBGA (42.5x42.5)

Dynamic RAM (DRAM)

DP8422V-33
DP8422V-33

National Semiconductor

DP8422V

Bulk

Active

4.5V ~ 5.5V

0°C ~ 70°C (TA)

Surface Mount

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

Dynamic RAM (DRAM)

DP84T22V-25
DP84T22V-25

National Semiconductor

DP84T22

Bulk

Active

4.5V ~ 5.5V

0°C ~ 70°C (TA)

Surface Mount

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

Dynamic RAM (DRAM)

QGE7520MC
QGE7520MC

Intel

Intel®E7000

Bulk

Active

-

-

Surface Mount

1077-BBGA, FCBGA

1077-FCBGA (42.5x42.5)

Dynamic RAM (DRAM)

TM248NBK36R-80
TM248NBK36R-80

Texas Instruments

*

Bulk

Active

-

-

-

-

-

-

DP8422VX-33
DP8422VX-33

National Semiconductor

DP8422V

Bulk

Active

4.5V ~ 5.5V

0°C ~ 70°C (TA)

Surface Mount

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

Dynamic RAM (DRAM)